[Tccc] CFP: TVT SI on Vehicle-Infrastructure Integration and Telematics Applications

==============================================================
IEEE Transactions on Vehicular Technology (TVT) on
Vehicle-Infrastructure Integration and Telematics Applications
==============================================================

For more than a hundred years, the benefits of personal and commercial
mobility, made possible by vehicular technology, have been a testimony to
the success of automobiles. Their collective presence --- more than a
billion registered cars, trucks and buses and growing in number --- places
a complex sustainability burden on society and on the planet through
factors such as roadway fatalities, fossil-fuel depletion, greenhouse gas
emissions & roadway congestion. During the past decade or so, there has
been a globally shared realization that in order to enhance the benefits
of automobiles and decrease their environmental footprint, the roadway
infrastructure and automobiles need to interact as part of an intelligent
transportation system (ITS). Coincident with the development of ITS, there
has been a much progress made with respect to transportation telematics
--- the interaction between automobiles and the infrastructure to deliver
services such as road-side assistance, automatic crash notification,
concierge assistance and vehicle health reports. There has been extensive
research & experimentation on both the underlying architectures and
technologies needed to fulfill the goals of ITS and deliver on the
expectations of telematics. A new era of vehicular technologies that
includes vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I)
communications is upon us, seeded by both (pre-competitive) public-sector
and private-sector funding. Examples include the dedicated short-range
communications (DSRC) radio under consideration in the United States (US)
for vehicle-infrastructure integration (VII) and a global system for
telematics (GST) chip-set in Europe. Examples of telematics or nomadic
device connectivity services include BMW's ASSIT in Europe, Ford's SYNC
and General Motors' OnStar, in the US and Toyota's G-Book in Japan.

Topics of Interest:
--------------------
- Vehicular technologies for intra-vehicle, V2V, V2I, extra-vehicle
networking & services;
- Vehicular technologies for connectivity to portable or nomadic digital
device & services;
- Vehicular technologies to enhance ITS and Telematics services.
- Microware radio & handover technologies for ITS and Telematics;
- Roadside system-level, board-level and chip-level electronics;
- Remote service provisioning and over-the-air vehicle software upgrade
technologies;
- End-to-end service delivery architectures, algorithms, protocols and
scalability;
- End-to-end quality of service, resource management, security & privacy;
- Rail transit vehicle interface and traffic management;
- Applications, including those relating to reduction in roadway
fatalities, fuel consumption, greenhouse gas emissions, roadway
congestion, digital entertainment & lifecycle maintenance;
- Results from large-scale experimental systems, test-beds and field
trials;
- Business models for ITS and Telematics.

Authors should follow the IEEE TVT manuscript format and submission
procedure which can be found at the IEEE TVT home page
http://transactions.vtsociety.org/ under Information for Authors. There
will be one round of reviews and acceptance will be limited to papers
needing only moderate revisions. Prospective authors should submit a PDF
version of their complete manuscript.

Important Dates:
Manuscript Due: January 1, 2008
Acceptance Notice: April 1, 2008
Final Manuscripts Due: May 15, 2008
Publication: September 2008

Guest Editors:
Dr. Tao Zhang
Chief Scientist
Applied Research
Telcordia Technologies
One Telcordia Drive
Piscataway, New Jersey 08854, USA
tao@research.telcordia.com

Prof. Char-Dir Chung
Graduate Institute of Communications
Engineering and Department of Electrical
Engineering
National Taiwan University
Taipei, Taiwan, R.O.C.
cdchung@cc.ee.ntu.edu.tw

Dr. To Russell Hsing
Executive Director of Emerging Technologies
and Services Research Department
Applied Research
Telcordia Technologies
One Telcordia Drive
Piscataway, New Jersey 08854, USA
trh@telcordia.com

Dr. K. Venkatesh Prasad
Group & Technical Leader
Infotronics Research & Advanced
Engineering
Ford Motor Company
Research & Innovation Center, MD 3137
Room 3011B
2101 Village Road,
Dearborn, Michigan 48121, USA
kprasad@ford.com
_______________________________________________
Tccc mailing list
Tccc@lists.cs.columbia.edu
https://lists.cs.columbia.edu/cucslists/listinfo/tccc