miércoles, 24 de octubre de 2007

[Tccc] CFP: IEEE Vehi-Mobi 2008 Workshop co-located with IEEE ICC 2008

IEEE Vehicular Networks & Applications Workshop

(IEEE Vehi-Mobi 2008)

Co-located with IEEE International Conference on Communications (ICC
2008)

19-23 May 2008, Beijing, China

http://vehi-mobi.must.edu.my

Aims and Scope

--------------

Vehicular communication networks have recently been gaining significant
popularity

and importance, primarily to cater to the emerging services involving road
safety and

a need for data-on-move. New technical challenges have evolved that demand

research and investigations. In China alone, the recent growth of the
automobile

industry and the associated services for transporting people and goods
safely and

efficiently would necessitate new research on vehicular networking. Car
industries are

of great importance in Asia and the rest of the world. Car markers from
Japan,

China, Korea, and India will be key players in car telematics. Much research
remain

to be done to bring alive the vision of future intelligent inter-vehicular
applications,

which will be supported by Car-to-Car communications and networks.

This workshop serves as a forum and intends to bring together researchers
and

engineers from both academia and industry to exchange ideas, share research

experiences, and report original work in all aspects of vehicular
communications,

sensors, networks, computing and applications.

List of Topics

--------------

Technical research papers are solicited in the following areas:

- ITS car-2-car networks

- ITS car-2-roadside communications

- MAC, routing, QoS, addressing, multicast, TCP protocols

- Traffic Congestion Control and Cooperative VANETs

- New application scenarios of ITS vehicular networks

- Mobility and handoff issues

- Sensors & Data Collection

- Content Distribution

- C2C communications

- Intra-car communications

- Traffic and flow control issues

- Info Dissemination; Data organization

- Security issues, architectures and solutions

- Privacy issues and solutions

- Data replication protocols in network partitions

- Hybrid Technologies (DSRC, WiMAX, WiFi, 3G/4G, etc.)

- Accident Prevention Algorithms via VANETs

- Internetworking and 802.11p WAVE ; 802.11s MESH; DSRC

- VANET Implementation/deployment status

- Network Management for C2C

- Power and energy management

- ITS / VANET Architectures

Important Dates

---------------

Paper Submission Deadline: December 20, 2007

Notification of Acceptance: January 28, 2008

Camera-Ready Submissions: February 28, 2008

Paper Submission

----------------

Authors are invited to submit original manuscripts on EDAS, which should be
written

in English and be no more than 7 pages in IEEE double-column format.

Submission implies the willingness of at least one of the authors to
register and

present the paper.

Executive Committee

-------------------

General Chairs

Prof. C.K.Toh University of Hong Kong

Dr. Russell Hsing Telcordia Technologies

TPC Chairs

Prof. Daniel Wong Malaysia University of Science and Technology

Prof. Subir Biswas Michigan State University, USA

Publicity Chair

Prof. D.K.Kim KNU, Korea

Technical Program Committee Members

-----------------------------------

Teruo Higashino, Osaka U, Japan

S Obana, ATR Japan

Wai Chen, Telcordia USA

Chen-Nee Chua, UC Davis, USA

B Krishnamachari, USC, USA

Herman Rohling, TU Braunschweig, Germany

Lars Wolf, TU Braunschweig, Germany

Eric Horlait, U Pierre et Marie Curie

Massao Nakagawa, Keio, Japan

Ouri Wolfson, Illinois Chicago

Nahid Shahmehri, Linkoping, Sweden

Fan Bai, Ford Motor Company

Hang Liu, Thomson

Onur Altintas, Toyota

Raja Sengupta, UC Berkeley

Kemal Tepe, U Windsor

Timo Kosch, BMW Germany

Baoyu Zheng, China

Sherman Shen, Waterloo, Canada

Victor Li, HKU

Joe Hui, ASA, USA

Zhisheng Niu, TsingHua U, China

FY Wang, U Arizona

D. Zeng, U of Arizona

E Hossain, Manitoba, Canada

Fei Richard Yu, Carleton, Canada

Lin Cai, Victoria U, Canada

Robert Li, Chinese U, Hong Kong

SC Liew, Chinese U, Hong Kong

Song Ci, Nebraska-Lincoln, USA

K Papgiannaki, INTEL, USA

A. Jamalipour, Sudney U, Autralia

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